1775698-1 datasheet

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• Маркировка
  1775698-1
• Производитель
  TE Connectivity
• Описание
  TE Connectivity 1775698-1 Applies To: Printed Circuit Board Assembly Process Feature: Without Pick and Place Cover Contact Plating, Mating Area, Material: Gold Contact Plating, Mating Area, Thickness (?µm [??in]): 0.762 [30] Contact Termination Type: Through Hole Gender: Receptacle Housing Color: Black Industry Standard: USB 2.0 Lead Free Solder Processes: Reflow solder capable to 245?°C, Reflow solder capable to 260?°C Led: Without Locating Post(s): Without Locking Feature: Without Mount Location: Bottom Edge Number Of Ports: 2 Number Of Positions: 4 Orientation: Right Angle Packaging Method: Tape & Reel Panel Ground: Without Pcb Mount Retention Type: SMT Hold Down Pcb Thickness, Recommended (mm [in]): 1.40 [0.055] Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Series: A Shell Plating: Nickel over Copper Size: Mini Tail Length (mm [in]): 2 [0.079] Termination Method: Solder Usb-if Test Id Number (tid): Not Submitted For Testing
• Количество страниц
  2 шт.
• Формат
  PDF

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• Размер файла
  212,48 KB

1775698-1 datasheet скачать

1775698-1 datasheet